Principal R&D Engineer (3DIC)
Synopsys (company site, opens in a new tab)15+ yrsNoidaOn-siteDirect career pageEst. 45–85 LPA
Posted 2d ago
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Job description
Structured overview of role & requirements
About This Role
- Develop and extend package substrate design automation features within the 3DIC Compiler platform for advanced multi-die systems.
- Own and maintain production-quality C/C++ code for functionalities like HDI substrate auto-routing, design rule checking, power delivery network analysis, and manufacturability.
- Collaborate with senior engineers, product teams, and customers to identify design bottlenecks and deliver well-scoped software solutions used by leading semiconductor companies.
Minimum Requirements
- 15+ years of relevant software or R&D experience.
- Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, or a related field.
- Strong proficiency in C/C++ with solid understanding of data structures and algorithms.
- Work Experience Required: 15+ years relevant experience in software or R&D.
Ideal Candidate Profile
- Experienced in large-scale C++ software development with production-quality code contributions.
- Familiarity or strong interest in physical design, EDA, semiconductor packaging, or advanced packaging domains.
- Demonstrates ability to work on complex, algorithmic, and performance-critical features with a focus on product impact and scalability.