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Job Description
Structured overview of role & requirementsAbout This Role
Develop, debug, and optimize ATE test programs for IoT and connectivity SoC products using Teradyne UltraFLEX-RF platforms for production and reliability testing.
Provide technical support and root-cause analysis to internal and external stakeholders, ensuring successful product development and qualification across cross-functional teams.
Leverage programming and scripting skills to automate and enhance semiconductor test development and silicon bring-up processes.
Minimum Requirements
Bachelor's or Master's degree in Electronics & Communication (ECE), Electrical & Electronics (EEE), or related fields required.
Strong understanding of semiconductor device fundamentals including analog, digital circuits, and circuit theory.
Hands-on experience with Design for Test (DFT) methodologies and semiconductor testing on Teradyne UltraFLEX-RF platforms (UltraFLEX+ experience is a plus).
Work Experience Required: Not explicitly mentioned in the JD.
Ideal Candidate Profile
Experienced in developing test solutions for IoT and connectivity semiconductor products with deep domain expertise in DFT, ATPG, PMU blocks, and trimming procedures.
Proficient in multiple programming/scripting languages (Perl, Python, C, C++, Java, Visual Basic) and comfortable working in UNIX/Linux environments for automation and debugging.
Able to collaborate effectively with cross-functional global teams including IP Design, Applications Engineering, DFT, Product Engineering, and Test Engineering.