3D-IC Methodology Architect

Develop and lead 3D-IC design and verification methodology focusing on EMAG, thermal, and packaging flows for multi-die systems.

Lead and mentor a technical team, drive standards across the organization and collaborate with vendors and internal stakeholders.

Scope customer requirements and integrate design flows by working with product line management, marketing, and cross-geo, cross-functional teams.

Bachelor's degree in Engineering or equivalent; advanced degrees (Masters/PhD) acceptable.

15+ years of relevant industry experience including over 10 years in design or design enablement of IPs.

Expertise in RF, AMS, silicon photonics, packaging design methodology, and EDA tools for analog, RF, AMS, and digital design.

Proficient in English (written and verbal) and Unix environment; strong communication skills; experience with version control and configuration management practices.

Senior-level professional with deep technical expertise in heterogeneous integration flows and 3D-IC methodology development.

Experienced in leading and mentoring technical teams in a multi-disciplinary and geographically distributed environment.

Skilled in collaborating with EDA vendors, product management, and design teams to develop and adopt design methodologies and standards.