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Tier-1 employer, metro location, senior title, and broad embedded-platform skillset create high competition.
Highly specialized embedded BSP, automotive platform, and hardware bring-up skills limit cross-industry transferability.
Explicit 8+ years plus mandatory BSP, embedded C/C++, and driver experience enforce strict shortlisting.
Lead complex technical initiatives in platform integration, test automation, and BSP enablement for Snapdragon Automotive platforms.
Develop and enhance test frameworks and automation to improve scalability, reliability, and validation coverage across multiple chipsets and domains.
Drive root-cause analysis and resolution of system-level issues across hardware, firmware, BSP, drivers, middleware, and applications, collaborating cross-functionally to execute programs.
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, or related field.
8+ years of experience in Software Engineering, Systems Engineering, Platform Integration, Embedded Software, or related area.
Proficiency in Python and Shell scripting; experience with embedded C/C++ and BSP customization on Qualcomm or equivalent platforms.
Working knowledge of HLOS internals, Linux drivers preferred; understanding of hardware schematics and embedded networking fundamentals (Ethernet, TCP/IP, automotive networking).
Experienced in driving technical decisions and leading cross-functional engineering projects in embedded platform environments.
Strong background in HLOS internals, embedded software development, and hardware/software integration specific to automotive or similar platforms.
Capable of independently building scalable automation tools and processes to enhance platform validation efficiency and quality.