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Tier-1 semiconductor brand plus metro location increase applicant density, but niche embedded SoC skills limit competition.
Embedded SoC firmware and silicon bring-up skills are highly domain-specific and not easily transferable.
Explicit 6+ years requirement and mandatory silicon bring-up, device driver, and low-level firmware skills enforce strict filtering.
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Develop and maintain embedded firmware including bootloaders, BSPs, device drivers, and HAL for next-generation SoCs/ASIC platforms.
Lead silicon and board bring-up activities including debugging and hardware/software integration using tools like JTAG, GDB, Lauterbach, oscilloscopes, and logic analyzers.
Collaborate across hardware, validation, verification, and architecture teams; mentor junior engineers; and drive subsystem development with focus on performance, power, memory, and reliability optimization.
Bachelor's or Master's degree in Computer Science, Electronics, Electrical Engineering, or related field.
6–10+ years of embedded firmware/software development experience.
Strong programming skills in Embedded C and Python; experience with bootloaders, BSPs, device drivers, HAL, and RTOS (FreeRTOS/Zephyr).
Experience with ARM/RISC-V architectures, interfaces (SPI, I2C, UART, USB, Ethernet), silicon/board bring-up, and debugging with JTAG, GDB, Lauterbach, oscilloscopes, and logic analyzers.
Experienced embedded software engineer comfortable working across full product lifecycle including pre-silicon enablement and post-silicon bring-up.
Proficient in debugging complex hardware/software integration issues and optimizing firmware characteristics such as power and memory.
Able to lead cross-functional collaboration and mentor junior team members in a technically challenging environment.