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Niche semiconductor TPM role with senior requirement and specialized SEMI/fab skills reduces candidate density.
Role requires semiconductor equipment, SEMI standards, and fab automation knowledge, limiting cross-industry transferability.
Explicit 12+ years and mandatory semiconductor equipment, SEMI and fab experience create rigid hiring filters.
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Lead end-to-end program management and delivery of multiple software subsystems within semiconductor equipment New Product Introduction (NPI) projects.
Own technical execution, schedule adherence, risk mitigation, and team leadership for assigned subsystems, coordinating across software, systems, product management, quality, and hardware teams.
Serve as primary contact for program status, drive stakeholder communication, and manage cross-functional dependencies and contingency planning.
Bachelor’s or master’s degree in Computer Science, Electronics, Electrical Engineering, or related field.
12+ years experience in technical project or engineering program management with mandatory semiconductor equipment software development and delivery experience.
Strong understanding of SEMI standards, SECS/GEM, and semiconductor fab automation workflows.
Work Experience Required: 12+ years in relevant domains as stated above.
Experienced in managing complex multi-disciplinary programs involving software, systems, and hardware teams with global distribution.
Technically proficient with hands-on software engineering understanding and capable of conducting high-level system and software design reviews.
Skilled in program planning, risk management, stakeholder communication, and cross-functional leadership within semiconductor equipment software development environments.