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Senior, niche semiconductor packaging role in non-metro location offsets brand pull, reducing candidate density.
Highly specialized semiconductor packaging and OSAT expertise makes skills less transferable across industries.
Mandatory 15+ years and specific OSAT/advanced-packaging methodologies (APQP, FMEA, SPC) create strict filters.
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Lead and oversee execution of the entire Technology Development customer programs end-to-end, including project planning, execution, and delivery.
Interface directly with customers and coordinate internally across multiple functions to manage new program planning and meet client requirements.
Own operational decisions to meet project targets (time, quality, cost, budget) and mentor a team of engineers through installation, qualification, and process/product phases.
Minimum 15 years experience in a leading OSAT environment with advanced packaging technologies such as flip chip.
Proven experience leading teams or groups toward organizational goals.
Engineering or Science degree mandatory.
Familiarity with technology development tools like APQP, 8D, DOE, SPC, FMEA, OCAP, and Control Plan.
Experienced program leader capable of managing complex semiconductor packaging technology developments with both startup and high-volume manufacturing exposure preferred.
Strong operational decision maker with a track record of meeting stringent customer targets and driving innovation in fast-paced environments.
Skilled mentor and coach who can lead relatively young engineering teams through technical challenges and customer-centric execution.