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Tier-1 brand, mid-level technical-lead title, and generalist fullstack skillset increase applicant competition.
Role requires semiconductor domain expertise, HPC and kernel skills, making background transferability limited.
Explicit minimum experience and many mandatory technologies create a high-filter recruiting process.
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Design, develop, integrate, maintain, and improve software for both On-Tool and Off-Tool analysis products in semiconductor inspection.
Lead a small engineering team for large feature developments ensuring robust, scalable, and high-performance software solutions.
Collaborate cross-functionally with product, business, and technical teams to mitigate risks and deliver scalable distributed computing applications leveraging microservices and cloud technologies.
Degree required: PhD (0 years experience), Master's (2 years experience), or Bachelor's (3 years experience).
Strong expertise in C++ and C# programming with proven Object-Oriented Design and Architecture skills.
Experience in full SDLC, multi-threading, distributed computing, and microservices architecture including containerized platforms like Docker and Kubernetes.
Hands-on experience with Angular and asynchronous programming (RxJS, Observables, Promises), and familiarity with Linux fundamentals and performance optimization.
Technical leader with strong programming fundamentals and experience mentoring others in SOLID design principles.
Experienced in designing high-performance, scalable computing frameworks and cloud-native applications for semiconductor manufacturing software.
Effective cross-functional communicator capable of balancing technical and business considerations within complex engineering projects.